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August 2015

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Subject:
From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Fri, 28 Aug 2015 17:49:53 +0000
Content-Type:
text/plain
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Hi Victor-

While Steve gets your new photo up, I just glanced at the previous ones again 
since the link was below your latest message. The curious spots are the voids 
adjacent to the plating on the via walls--why didn't it plate into the voids? 
Is it possible the voids are created by your sectioning/polishing process?

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Friday, August 28, 2015 12:02 PM
To: [log in to unmask]
Subject: [TN] Internal layer capture pad clearance

Steve,

   Can you please post this photo for me.   I would like to hear comments from 
our audience and their experience.   What is the worst scenario?   I am aware 
if IPC STD guidelines,  0.984 mil  (0.025mm).

Victor,

From: Steve Gregory [mailto:[log in to unmask]]
Sent: Friday, August 14, 2015 4:26 PM
To: TechNet E-Mail Forum; Hernandez, Victor G
Subject: Re: [TN] Pros & Cons om laminate VOIDS

Hi Victor,

Here you go:

http://stevezeva.homestead.com/Laminate_voids.pdf

Steve

On Fri, Aug 14, 2015 at 12:23 PM, Victor Hernandez 
<[log in to unmask]<mailto:[log in to unmask]>> wrote:
Fellow TechNetters:

   What are the Pros N Cons with LF laminate voids.   Want to hear what the 
community thinks.   I will upload photos to Steve Gregory shortly.

Victor,

Steve Gregory <[log in to unmask]<mailto:[log in to unmask]>>

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