Hi Geok Ang,
I worked at a previous employer who did embedded capacitors and resistors.
I worked at the assembly division of R&D Circuits, and the PCB Division in
New Jersey fabricated the boards for us.
They could do some pretty amazing things in New Jersey, 40-layer boards,
vias with aspect ratios of 30:1 or more, and embedded components. Check
out:
http://www.rdaltanova.com/board-manufacturing/
Steve
On Tue, Jun 30, 2015 at 6:16 PM, Tan Geok Ang <[log in to unmask]> wrote:
> Dear All,
> Thank for the terms clarification. I am looking for insert
> (discrete) embedded components not form (planar/thin-film) embedded
> components in PCB.
> Regards
> Geok Ang
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Joel Peiffer
> Sent: Wednesday, 1 July 2015 5:32 AM
> To: [log in to unmask]
> Subject: Re: [TN] PCB Fabrication house with Embedded
> DiscreteComponentCapability
>
> Hi Richard,
>
> These may be terms that are utilized elsewhere in the electronics industry
> but for Embedded Components which we are discussing below, per IPC
> documentation, Formed components and Placed (or Inserted) components are
> classes of embedded components. Check out the IPC documentation in
> IPC-2316 and elsewhere. I have worked in the embedded components industry
> for 20 years and these are the terms that are used.
>
> Regards, Joel
>
> -----Original Message-----
> From: Stadem, Richard D. [mailto:[log in to unmask]]
> Sent: Tuesday, June 30, 2015 3:32 PM
> To: TechNet E-Mail Forum; Joel Peiffer
> Subject: [EXTERNAL] RE: PCB Fabrication house with Embedded Discrete
> ComponentCapability
>
> No, the commonly understood terms within the industry are:
>
> 1) "Formed components" are those whose leads are formed prior to assembly.
> Examples are SMT QFPs and SOICs where the leads exit at the top of the body
> and are in frames, where prior to assembly the QFP requires excision from
> the frame and the leads are also formed into a gullwing shape. Another
> example is through-hole axial leads bent 90 degrees and trimmed, sometimes
> with a standoff bend, etc.
>
> 2) "Inserted components" are typically considered to be PTH components
> that are inserted into PTH holes and soldered, either by hand or by axial
> insertion machines along with selective or wave soldering.
>
> 3) "Embedded components" are those that are embedded into the PWB as part
> of the PWB fabrication process. Just about every smart phone and tablet
> utilizes embedded technology. There is more than one process for doing
> this; conductive-ink printed and subsequently laminated PWBs, or
> encapsulated, such as Joe (The Wizard) Fjelstad's Verdant Occam process.
>
> dean
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Joel Peiffer
> Sent: Tuesday, June 30, 2015 3:08 PM
> To: [log in to unmask]
> Subject: Re: [TN] PCB Fabrication house with Embedded Discrete Component
> Capability
>
> "Inserted Components" are fully functional components such as caps,
> resistors, etc. that can be inserted into boards. "Formed" components are
> components that made as part of the PCB fab process. Both inserted and
> formed components (mostly caps and resistors) are fairly common these days
> for many products (for example, just about every smart phone and tablet
> utilizes formed technology). Inserted components were probably first used
> in the 1980s or early 1990s. Formed components were first used the 1960s.
>
> You need to define whether you mean inserted or formed as many PCB fabs
> utilize one technology but few offer both.
>
> Regards, Joel
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
> Sent: Tuesday, June 30, 2015 12:02 PM
> To: [log in to unmask]
> Subject: [EXTERNAL] Re: [TN] PCB Fabrication house with Embedded Discrete
> Component Capability
>
> Hi GA Tan-
>
> The question is what you mean by "discrete". For most people it means a
> passive which "stands on its own" as opposed to something done with special
> dielectrics and/or resistive metal layers to create passives within a
> circuit board.
>
> For the embedding of truly discrete components, this is Joe Fjelstad's
> special area. He had a shop build a demo circuit. His website covering the
> technology is www.verdantelectronics.com
>
> The tricky part is how to electrically connect to the passives. Probably a
> laser could be used to dig down to the part and then plate up a contact.
> But most end terminations are covered with Sn, which is particularly
> difficult to make contact to (other than with solder).
>
> For the other technique, using special foils and/or dielectrics, there are
> a few competing products. They all seem to substantially increase the
> number of steps required to make a board, and they are so
> volume-inefficient that there are only a small number of cases where they
> work out economically.
>
> Wayne Thayer
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Tan Geok Ang
> Sent: Tuesday, June 30, 2015 10:13 AM
> To: [log in to unmask]
> Subject: [TN] PCB Fabrication house with Embedded Discrete Component
> Capability
>
> Dear All,
> I'm looking for PCB supplier who has the above capability
> for proto design. Any recommendation? Thank in advance.
>
> Regards
> GA Tan
>
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