Hi Joyce, Board has heavy copper planes and a lot of topside passives on the board are not wetting very well with SAC alloys, so the switch to low melt Sn /Bi solder to facilitate the soldering of passives.
Thank-you
Mumtaz
858-795-0112
Peregrine Semiconductor
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Friday, July 24, 2015 8:01 AM
To: [log in to unmask]
Subject: Re: [TN] Soldering NiPdAu finish components with low melt solder
The question is why they need to use low melting temp solder - something else on the board is not allow to be heat up? if so, the finish of the parts is not a good selection (should get caught during BOM design review). Just curious.
jk
> Hi Mumtaz - two things we have seen that are important when soldering
> NiPdAu component finishes are (1) soldering temperature/profile. Pd
> dissolves much slower into Sn than other elements so running the
> soldering temperatures 10 degrees hotter than typical and increasing
> the soldering time 3-5 seconds longer than typical can be beneficial;
> (2) flux formulation. Some fluxes work better than others when Pd is
> included in the soldering situation. Hope this helps.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
> On Thu, Jul 23, 2015 at 10:46 AM, Mumtaz Bora <[log in to unmask]> wrote:
>
>> Dear All, Good Morning, Looking for some knowledge base on soldering
>> NiPdAu finished components with low melt solder such as
>> Sn42.0Bi57.6Ag0.4
>> to avoid wetting issues on a heavy copper plane board. Any insight
>> and advise will be appreciated.
>>
>> Thank-you
>> Mumtaz
>> 858-795-0112
>> Peregrine Semiconductor
>>
>>
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