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July 2015

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Subject:
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Tue, 28 Jul 2015 09:50:27 +0000
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Base on PCB design with respect to PCB manufacturing capabilities of your suppliers. E.g. Due to misregistration between layers where it resulted C-pad PTH within layers due to tolerance between "via pad size and drill-size), it will somehow cause a less reliable result.
2censt input

________________________________________
From: TechNet [[log in to unmask]] on behalf of Louis Hart [[log in to unmask]]
Sent: Friday, 24 July, 2015 3:37:09 AM
To: [log in to unmask]
Subject: Re: [TN] PWB Inner layer Misregistration

Victor, let an expert correct me, but misregistration layer-to-layer in some PWB designs could impact integrity of differential signals. Such designs appear to be quite rare, perhaps for the reason I propose.  Louis Hart

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, July 23, 2015 9:44 AM
To: [log in to unmask]
Subject: [TN] PWB Inner layer Misregistration

Fellow TechNetters:

   Is there a correlation between PWB inner layer misregistration and reliability?   What is IPC guidelines numerical value with regards to inner layer misregistration hole breakout of signal capture pad (s)?   I always hear of +/- 3 mils for all processes in the PWB process.

Victor,


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