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July 2015

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From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 24 Jul 2015 11:01:11 -0400
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The question is why they need to use low melting temp solder - something
else on the board is not allow to be heat up?  if so, the finish of the
parts is not a good selection (should get caught during BOM design
review). Just curious.
            jk
> Hi Mumtaz - two things we have seen that are important when soldering
> NiPdAu component finishes are (1) soldering temperature/profile. Pd
> dissolves much slower into Sn than other elements so running the soldering
> temperatures 10 degrees hotter than typical and increasing the soldering
> time 3-5 seconds longer than typical can be beneficial; (2) flux
> formulation. Some fluxes work better than others when Pd is included in
> the
> soldering situation. Hope this helps.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
> On Thu, Jul 23, 2015 at 10:46 AM, Mumtaz Bora <[log in to unmask]> wrote:
>
>> Dear All, Good Morning,   Looking for some knowledge base  on soldering
>> NiPdAu finished components with low melt solder such as
>> Sn42.0Bi57.6Ag0.4
>> to avoid wetting issues on a heavy copper plane board. Any insight and
>> advise will be appreciated.
>>
>> Thank-you
>> Mumtaz
>> 858-795-0112
>> Peregrine  Semiconductor
>>
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