Thank you very much for the information!

Best regrads

Enrico

Il 23/07/2015 17.37, Kerr, Bryan (UK) ha scritto:
> Hi
>
> Not sure about using low melt solders but this finish always shows higher levels of voiding with a tin/lead process. Not my favourite finish!
>
> Cheers
>
>
> Bryan Kerr
> CMA Lab and Process Engineering Manager
> BAE Systems Maritime Services
> Manufacturing Hillend
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> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Mumtaz Bora
> Sent: 23 July 2015 15:46
> To: [log in to unmask]
> Subject: [TN] Soldering NiPdAu finish components with low melt solder
>
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> Dear All, Good Morning,   Looking for some knowledge base  on soldering NiPdAu finished components with low melt solder such as Sn42.0Bi57.6Ag0.4 to avoid wetting issues on a heavy copper plane board. Any insight and advise will be appreciated.
>
> Thank-you
> Mumtaz
> 858-795-0112
> Peregrine  Semiconductor
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Enrico Galbiati
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