Hi Mumtaz - two things we have seen that are important when soldering
NiPdAu component finishes are (1) soldering temperature/profile. Pd
dissolves much slower into Sn than other elements so running the soldering
temperatures 10 degrees hotter than typical and increasing the soldering
time 3-5 seconds longer than typical can be beneficial; (2) flux
formulation. Some fluxes work better than others when Pd is included in the
soldering situation. Hope this helps.

Dave Hillman
Rockwell Collins
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On Thu, Jul 23, 2015 at 10:46 AM, Mumtaz Bora <[log in to unmask]> wrote:

> Dear All, Good Morning,   Looking for some knowledge base  on soldering
> NiPdAu finished components with low melt solder such as Sn42.0Bi57.6Ag0.4
> to avoid wetting issues on a heavy copper plane board. Any insight and
> advise will be appreciated.
>
> Thank-you
> Mumtaz
> 858-795-0112
> Peregrine  Semiconductor
>
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