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July 2015

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Subject:
From:
"Kerr, Bryan (UK)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kerr, Bryan (UK)
Date:
Thu, 23 Jul 2015 15:37:23 +0000
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Hi

Not sure about using low melt solders but this finish always shows higher levels of voiding with a tin/lead process. Not my favourite finish!

Cheers


Bryan Kerr
CMA Lab and Process Engineering Manager
BAE Systems Maritime Services
Manufacturing Hillend
Hillend Industrial Estate
Hillend
Nr Dunfermline
Fife
Scotland
KY11 9HQ
01383-836097


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mumtaz Bora
Sent: 23 July 2015 15:46
To: [log in to unmask]
Subject: [TN] Soldering NiPdAu finish components with low melt solder

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Dear All, Good Morning,   Looking for some knowledge base  on soldering NiPdAu finished components with low melt solder such as Sn42.0Bi57.6Ag0.4 to avoid wetting issues on a heavy copper plane board. Any insight and advise will be appreciated.

Thank-you
Mumtaz
858-795-0112
Peregrine  Semiconductor


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