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July 2015

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Subject:
From:
Mumtaz Bora <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mumtaz Bora <[log in to unmask]>
Date:
Thu, 23 Jul 2015 14:46:06 +0000
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Dear All, Good Morning,   Looking for some knowledge base  on soldering NiPdAu finished components with low melt solder such as Sn42.0Bi57.6Ag0.4 to avoid wetting issues on a heavy copper plane board. Any insight and advise will be appreciated.

Thank-you
Mumtaz
858-795-0112
Peregrine  Semiconductor


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