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July 2015

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 21 Jul 2015 12:21:14 -0400
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what temp? what is glass transition temperature of the pcb?  what
material? what oven?  i guess it is not nitrogen.... what surface
finishing?
without any background, no comment.
                jk
> Fellow TechNetters:
>
>    While some PWB coupons, 1"x1"-0.062 " thickness, were left in the
> BAKING over for an extended period, 24 hrs., prior to Thermal Stress,
> Solder Float.   Is there any exposure with processing these sample for
> cross section.   I realize that if unusual artifacts are visible they
> could have been induced by the over baking process.   I need your
> input.
>
> Victor,
>
>
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