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Date: | Tue, 21 Jul 2015 13:04:49 +0000 |
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What temperature, and what type of finish? Any information on type of PWB (IPC4101 slash sheet info)? And what are they being microsectioned for? Solderability, BGA solder balls, PWB compliance,.....
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Tuesday, July 21, 2015 7:56 AM
To: [log in to unmask]
Subject: [TN] PWB coupon baking
Fellow TechNetters:
While some PWB coupons, 1"x1"-0.062 " thickness, were left in the BAKING over for an extended period, 24 hrs., prior to Thermal Stress, Solder Float. Is there any exposure with processing these sample for cross section. I realize that if unusual artifacts are visible they could have been induced by the over baking process. I need your input.
Victor,
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