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July 2015

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 21 Jul 2015 13:04:49 +0000
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What temperature, and what type of finish? Any information on type of PWB (IPC4101 slash sheet info)? And what are they being microsectioned for? Solderability, BGA solder balls, PWB compliance,.....

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Tuesday, July 21, 2015 7:56 AM
To: [log in to unmask]
Subject: [TN] PWB coupon baking

Fellow TechNetters:

   While some PWB coupons, 1"x1"-0.062 " thickness, were left in the BAKING over for an extended period, 24 hrs., prior to Thermal Stress, Solder Float.   Is there any exposure with processing these sample for cross section.   I realize that if unusual artifacts are visible they could have been induced by the over baking process.   I need your input.

Victor,


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