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June 2015

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Subject:
From:
Mumtaz Bora <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mumtaz Bora <[log in to unmask]>
Date:
Wed, 17 Jun 2015 16:57:28 +0000
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Thank-you Ed, much appreciated.


Thank-you
Mumtaz
858-795-0112
Peregrine  Semiconductor



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ed Popielarski
Sent: Wednesday, June 17, 2015 9:40 AM
To: [log in to unmask]
Subject: Re: [TN] BGA/Flp chip Reballing - Lead Free

I have had excellent results from these folks as well. IMHO, easier to work with and lower prices!

http://www.solder.net/products/ezreball/

Ed Popielarski
Engineering Manager


                               970 NE 21st Ct.
                              Oak Harbor, Wa. 98277

                              Ph: 360-675-1322
                              Fx: 206-624-0695
                              Cl: 949-581-6601



       “It's one kind of victory to slay a beast, move a mountain, and cross a chasm, but it's another kind altogether to realize that the beast, the mountain, and the chasm were of your own design.”
https://maps.google.com/maps/myplaces?hl=en&ll=48.315753,-122.643578&spn=0.011188,0.033023&ctz=420&t=m&z=16&iwloc=A

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Wednesday, June 17, 2015 8:41 AM
To: [log in to unmask]
Subject: Re: [TN] BGA/Flp chip Reballing - Lead Free

Hi Mumtaz,

Have you ever looked into SolderQuik reballing preforms? They work very well. They don't go down as small as 2x2mm packages, but they do go down to 3.5x3.5mm. Pitches down to .5mm and ball diameters down to .013mm.

I've used them many times in the past, and they make it really easy. You don't need stencils or any special equipment to do reballing, just a small aluminum fixture to place the parts in to reflow them.

 https://www.youtube.com/watch?v=lXkKVxEE7bA

Steve

On Mon, Jun 15, 2015 at 12:23 PM, Mumtaz Bora <[log in to unmask]> wrote:

> Dear All, Good Morning, I hope your Monday is going well.
>
> We are looking for BGA/flip chip  reballing equipment. My web search
> shows that there are several models available. The flip chips are
> tighter pitch around 150- 200 microns and have smaller bumps - 70
> micron height and 110 um diameter.  Package size ranges from 2x2 mm to
> 5x5 mm. If anyone has any experience with reballing fine pitch and has
> recommendations, please advise . Your inputs will be greatly
> appreciated. You can also contact me offline
> - [log in to unmask]
>
> Best Regards,
> Mumtaz
> 858-795-0112
> Peregrine  Semiconductor
>
>
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