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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mumtaz Bora
Sent: Monday, June 15, 2015 2:24 PM
To: [log in to unmask]
Subject: [TN] BGA/Flp chip Reballing - Lead Free

Dear All, Good Morning, I hope your Monday is going well.

We are looking for BGA/flip chip  reballing equipment. My web search shows
that there are several models available. The flip chips are tighter pitch
around 150- 200 microns and have smaller bumps - 70 micron height and 110 um
diameter.  Package size ranges from 2x2 mm to 5x5 mm. If anyone has any
experience with reballing fine pitch and has recommendations, please advise
. Your inputs will be greatly appreciated. You can also contact me offline -
[log in to unmask]

Best Regards,
Mumtaz
858-795-0112
Peregrine  Semiconductor


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