Hi Mumtaz,
Have you ever looked into SolderQuik reballing preforms? They work very
well. They don't go down as small as 2x2mm packages, but they do go down to
3.5x3.5mm. Pitches down to .5mm and ball diameters down to .013mm.
I've used them many times in the past, and they make it really easy. You
don't need stencils or any special equipment to do reballing, just a small
aluminum fixture to place the parts in to reflow them.
https://www.youtube.com/watch?v=lXkKVxEE7bA
Steve
On Mon, Jun 15, 2015 at 12:23 PM, Mumtaz Bora <[log in to unmask]> wrote:
> Dear All, Good Morning, I hope your Monday is going well.
>
> We are looking for BGA/flip chip reballing equipment. My web search shows
> that there are several models available. The flip chips are tighter pitch
> around 150- 200 microns and have smaller bumps - 70 micron height and 110
> um diameter. Package size ranges from 2x2 mm to 5x5 mm. If anyone has any
> experience with reballing fine pitch and has recommendations, please advise
> . Your inputs will be greatly appreciated. You can also contact me offline
> - [log in to unmask]
>
> Best Regards,
> Mumtaz
> 858-795-0112
> Peregrine Semiconductor
>
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