Dear All, Good Morning, I hope your Monday is going well.

We are looking for BGA/flip chip  reballing equipment. My web search shows that there are several models available. The flip chips are tighter pitch around 150- 200 microns and have smaller bumps - 70 micron height and 110 um diameter.  Package size ranges from 2x2 mm to 5x5 mm. If anyone has any experience with reballing fine pitch and has recommendations, please advise . Your inputs will be greatly appreciated. You can also contact me offline - [log in to unmask]

Best Regards,
Mumtaz
858-795-0112
Peregrine  Semiconductor


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