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June 2015

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From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 15 Jun 2015 15:53:54 +0000
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It also takes into consideration the ideal paste printing conditions. Humidity and temperature both greatly affect the solder paste rheology, and thus directly affect printing performance, time on the stencil, etc.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Monday, June 15, 2015 8:54 AM
To: [log in to unmask]
Subject: Re: [TN] Solder Paste ambient temperature and humidity

The IPC recommendation for humidity is related to ESD control. The temperature recommendation is for operator comfort and solderability maintenance. 

J-SDT-001. 30%RH and 18-30 Celsius. 



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Avni Selim Özçukurlu
Sent: Monday, June 15, 2015 4:54 AM
To: [log in to unmask]
Subject: [TN] Solder Paste ambient temperature and humidity

Hello All,

What should the average temperature and humidity level be in an electronic assembly and manufacturing facility? Especially, during solder paste print process to PCB,  what is the ideal temperature and humidity? Is there any ipc standart?

Note: We use Amtech NWS-4200.


A.Selim ÖZÇUKURLU
Aselsan MGEO - CCA Production and Test Engineer
Tel: 90 312 847 53 00 / 4570



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Firmamiza gelen ve giden mesajlar virus taramasindan gecirilmekte, guvenlik nedeni ile kontrol edilerek saklanmaktadir. Mesajdaki gorusler ve bakis acisi gondericiye ait olup Aselsan A.S. resmi gorusu olmak zorunda degildir.

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