Hi Bob - we routinely use the dippable paste for BGA and CSP rework with
great success. However, our efforts on QFPs have not been as successful.
The technique has worked successfully for the larger pitch QFPs  but on the
fin pitch QFPs we have had significant bridging issues.

Dave Hillman
Rockwell Collins
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On Mon, Jun 29, 2015 at 11:25 AM, Bob Wettermann <[log in to unmask]> wrote:

> Hi All:
>
> We have a project where we need to rework 10's of thousands of LQFP
> 100/0.5mm pitch devices. All options are being considered.
>
> Since the PoP dipping pastes have come in to their own has anyone tried
> using these pastes to dip for fine pitch rework?
>
> Thanks!
>
> --
> Bob Wettermann
> BEST Inc
>
>
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