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Date: | Mon, 29 Jun 2015 16:59:39 -0400 |
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http://www.zeph.com/pencil.html
hot air pencil...
> rework: you mean take the original part off and rotated 90 degree and put
> back on the same part? or you intend to put a new part on? If it is old
> part - you might got difficulty due to damaged lead (coplanarity is
> gone... unless you have enough space to push down using bar, etc.). if it
> is new part, since you are going to do 10's thousands, you might get some
> pre-form made to match the footprint and use hot air pencil or small batch
> reflow - depend upon what your design is on the other side... dip on fine
> pitch is "play with fire"... assume it is Cu-based leads. - my 1.5
> cents.
> jk
>> Hi Bob,
>>
>> 10's of thousands? Wow. I have never used dipping pastes, but it would
>> seem
>> to me that you would definitely need some sort of automation to
>> accomplish
>> this, have you looked at automated lead tinning machines? Ace
>> Production
>> Technologies, RPS Automation, and Corfin Industries make lead tinning
>> systems. I would also guess that the solder would tend to stay towards
>> the
>> bottom of the lead and not coat the entire lead with the dipping paste.
>>
>> Good luck!
>>
>> Steve Gregory
>>
>> On Mon, Jun 29, 2015 at 10:25 AM, Bob Wettermann <[log in to unmask]>
>> wrote:
>>
>>> Hi All:
>>>
>>> We have a project where we need to rework 10's of thousands of LQFP
>>> 100/0.5mm pitch devices. All options are being considered.
>>>
>>> Since the PoP dipping pastes have come in to their own has anyone tried
>>> using these pastes to dip for fine pitch rework?
>>>
>>> Thanks!
>>>
>>> --
>>> Bob Wettermann
>>> BEST Inc
>>>
>>>
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