and yes, you need to use a dip formula. Regular stencil print solder paste 
will not dip well. Our supplier was very helpful with the selection.



Roger Mack  P.Eng. 
Manufacturing Specialist
Parker Hannifin Canada
Electronic Controls Division
1305 Clarence Avenue
Winnipeg, MB  R3T 1T4 Canada 
direct 204 453 3339 x7373
[log in to unmask]
www.parker.com/ecd







From:   Roger Mack <[log in to unmask]>
To:     <[log in to unmask]>
Date:   2015-06-29 02:07 PM
Subject:        Re: [TN] Solder Paste Dipping Ultra Fine Pitch QFPs for 
Reork?
Sent by:        TechNet <[log in to unmask]>



I rework all BGA's using dip paste. Nice uniform coating covers the bottom 

half of the ball consistently. As BGA's got smaller stencil on part just 
never released cleanly.

This also trades lots of stencils for a few thickness of dip trays. I make 

them so they fit on our stencil tray so the dip sequence runs on our VJ 
electronix (SRT) rework machine the same as picking any part out of a 
stencil. The dip sequence just adds an extra step to pick from one nest, 
then dip into the dip tray before placing on the board.

We x-ray all reworked parts and this proved to be much more consistent.

Have not yet tested dipping QFP's . The ones we rework have a center 
cooling plate to solder so we have had great results using the stick n 
peel stencil from BEST for that.



Roger Mack  P.Eng. 
Manufacturing Specialist
Parker Hannifin Canada
Electronic Controls Division
1305 Clarence Avenue
Winnipeg, MB  R3T 1T4 Canada 
direct 204 453 3339 x7373
[log in to unmask]
www.parker.com/ecd







From:   Steve Gregory <[log in to unmask]>
To:     <[log in to unmask]>
Date:   2015-06-29 01:44 PM
Subject:        Re: [TN] Solder Paste Dipping Ultra Fine Pitch QFPs for 
Reork?
Sent by:        TechNet <[log in to unmask]>



Hi Bob,

10's of thousands? Wow. I have never used dipping pastes, but it would 
seem
to me that you would definitely need some sort of automation to accomplish
this, have you looked at automated lead tinning machines?  Ace Production
Technologies, RPS Automation, and Corfin Industries make lead tinning
systems. I would also guess that the solder would tend to stay towards the
bottom of the lead and not coat the entire lead with the dipping paste.

Good luck!

Steve Gregory

On Mon, Jun 29, 2015 at 10:25 AM, Bob Wettermann <[log in to unmask]> 
wrote:

> Hi All:
>
> We have a project where we need to rework 10's of thousands of LQFP
> 100/0.5mm pitch devices. All options are being considered.
>
> Since the PoP dipping pastes have come in to their own has anyone tried
> using these pastes to dip for fine pitch rework?
>
> Thanks!
>
> --
> Bob Wettermann
> BEST Inc
>
>
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