The link below describes an old school semi- automated dip device used for solderability testing :
https://www.ipc.org/TM/2.4.12a.pdf
The original citation for this device came from a now obsolete Military soldering specification.
Does anyone recall that mil spec document number? I thought it might be in Mil Spec 28809 but I don't see it there.
To cut to the chase,... I seem to recall that military specification even mentioned a manufacturer. That is what I am ultimately looking for.
Any help would be appreciated.
Thanks in advance
Rich Kraszewski
Senior Process Engineer
Plexus Engineering Solutions
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