Hi Louis-

A high resolution optical microscope is usually the best tool for this.
There are some microscopes explicitly designed for this, but we find no need
to go beyond 400X. The depth of field at this magnification is +/-2 microns.
The better microscopes with this resolution have the focus dial demarked in
microns. This is inadequate for our use because of the stage backlash, so we
have adapted a digital depth gauge to measure stage height directly.

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis Hart
Sent: Friday, May 15, 2015 1:24 PM
To: [log in to unmask]
Subject: [TN] measuring bump heights

Technetters, how can one measure solder or copper bump heights on an IC or
PC board?  Heights and spacings I am interested in are in the range of
100-200 microns and 300-400 microns, respectively.

Thanks for any help.

Maybe someone in the foil business is on technet. At EXPO, there have been
discussions of foil roughness measurement techniques.  My problem is, I
think, an easy one by comparison.   Louis Hart

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