For a moment there I thought what have we done to offend you?

[Ask a teenager if you don't understand this reply :)]

 
--
Best Wishes
 
 
 
Mike-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Wednesday, May 13, 2015 2:42 PM
To: [log in to unmask]
Subject: [TN] Wire bonding DPMO

Dear Technos,

Any of you using DPMO to track wire bonding process performance?

I would like to know what are the defects you use to calculate your product
DPMO, as wire bonding can produce tons of different defects, e.g. wire
related (deformed, broken, poor loop, etc.), bond related (misformed, heel
lift, offset, and so on).
The more defects you consider, the lower the DPMO, as there are many more
opportunities per unit. That would be a good indicator to show to customers,
but in our case, we want to get a fair assessment of our processes, for our
own process improvement use.


So what are the defect opportunities I should count for one wire?

Thanks,

Ioan Tempea
MDA Corporation

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