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May 2015

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Subject:
From:
Mumtaz Bora <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mumtaz Bora <[log in to unmask]>
Date:
Wed, 13 May 2015 20:29:15 +0000
Content-Type:
text/plain
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Hi Ioan,  There can be many defects in wire bond, but it is typically  limited to the critical defects for the process controls.

We look for wire diameter, loop height, ball size, ball thickness, ball centering, wire length, pad cratering and wire pull data and ball shear data.




Thank-you
Mumtaz
858-795-0112
Peregrine  Semiconductor


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Wednesday, May 13, 2015 6:42 AM
To: [log in to unmask]
Subject: [TN] Wire bonding DPMO

Dear Technos,

Any of you using DPMO to track wire bonding process performance?

I would like to know what are the defects you use to calculate your product DPMO, as wire bonding can produce tons of different defects, e.g. wire related (deformed, broken, poor loop, etc.), bond related (misformed, heel lift, offset, and so on).
The more defects you consider, the lower the DPMO, as there are many more opportunities per unit. That would be a good indicator to show to customers, but in our case, we want to get a fair assessment of our processes, for our own process improvement use.

So what are the defect opportunities I should count for one wire?

Thanks,

Ioan Tempea
MDA Corporation

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