Dear Technos,

Any of you using DPMO to track wire bonding process performance?

I would like to know what are the defects you use to calculate your product DPMO, as wire bonding can produce tons of different defects, e.g. wire related (deformed, broken, poor loop, etc.), bond related (misformed, heel lift, offset, and so on).
The more defects you consider, the lower the DPMO, as there are many more opportunities per unit. That would be a good indicator to show to customers, but in our case, we want to get a fair assessment of our processes, for our own process improvement use.

So what are the defect opportunities I should count for one wire?

Thanks,

Ioan Tempea
MDA Corporation

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________