Hi Steve - assuming you are using SAC305 solder, then any element(s) you
"add" to the SAC305 solder joints that has a lower melting temperature will
allow you to remove the connectors at a lower temperature. Since indium
melts at 157C, you would lower the melting point of SAC305 to something
below 217C depending on what the final solder composition ends up being.
And depending on the alloy phase diagram, you could end up being even lower
if specific alloy combinations are formed.  The bigger issue is that if you
don't get all of the "new" solder composition off the pads or the connector
(if you planned on reusing it) as part of your rework process, then you
will have unknown solder joint integrity which may or may not be
appropriate for the product use environment. Food for thought.

Dave Hillman
Rockwell Collins
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On Tue, May 5, 2015 at 1:07 PM, Steve Gregory <[log in to unmask]> wrote:

> Hi All,
>
> Do any of you know if the Chip Quik Removal alloy (Tin 30%, Bismuth 56%,
> Indium 14%) works with lead-lead free solder?
>
> We have a board here that has to have some connectors reworked that are
> absolutely a bear to remove and I was wondering if it works with lead-free
> solder?
>
> Steve
>
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