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April 2015

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 14 Apr 2015 14:58:51 -0400
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agree with Mike.  two typical application: high density multi-level wire
bonds for stack die (memory or something like piggy backed dram on
processor - need high speed, high density access).  or high power
application, thick gold wire bond just too pricy.  Thick copper wire bonds
is easy, but not HDI type...
FA is need some new tools: you can't use chemical decapsulation, it eats
copper no time.  you will need some laser decap equipment.  if you just
want to get into the game, there is not so low barrier for entry.  prepare
for 3 month at least for learning curve for HDI, thick wire or ribbon, not
much or problem, you just need to get hang of it.
my 1.6 cents.
                jk
> As I understand it, copper is replacing gold especially at small diameters
> and has pretty well displaced aluminium at large diameters/ribbons in
> power
> devices (eg IGBT)where its properties are very advantageous. Bonding is
> done
> under local inert or forming gas environment.
> --
> Regards
>
> Mike Fenner
> Bonding Services & Products
> M: +44 [0] 7810 526 317
> T: +44 [0] 1865 522 663
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Syed Ahmad
> Sent: Tuesday, April 14, 2015 2:34 PM
> To: [log in to unmask]
> Subject: Re: [TN] Copper Wire Bonds
>
> One may find copper wire coated with Pd to alleviate its corrosion. Copper
> does make intermetallics with Al but Kirkendall voiding does not occur as
> in
> Au-Al bonds. Use of copper as wafer metallization is increasing and thus
> so
> is the use of copper wire.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
> Sent: Tuesday, April 14, 2015 8:21 AM
> To: [log in to unmask]
> Subject: Re: [TN] Copper Wire Bonds
>
> Hi Victor-
>
> Yes, copper wirebond technology is now available (I've only seen this done
> as ball bonding). We haven't upgraded our equipment for it as of yet, but
> the kit isn't real expensive. I understand that the balls are harder, so
> cratering is probably seen more often. I don't know offhand what
> temperature
> the welding is done at.
>
> Aluminum is cheaper,  very easy to bond with (room temperature welding),
> and
> doesn't need cover gas. But only available as wedge bonding, which can't
> match the pitch of balls.
>
> Wayne
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
> Sent: Tuesday, April 14, 2015 9:01 AM
> To: [log in to unmask]
> Subject: [TN] Copper Wire Bonds
>
> Fellow TechNetters:
>
>    What is the story behind Copper Wire Bonds.   I have heard of them but
> now I have witness one.   Any details out there on this technology?   I
> will
> have to search archives.
>
> Victor,
>
>
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