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April 2015

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 8 Apr 2015 17:08:40 -0400
Content-Type:
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provide you have good solder mask...
  jk
> Thanks for all the feedback.
> It seems that there may be acceptable applications for transferring solder
> from the iron; specifically when you can inspect the result to be sure
> that you have gotten good wetting.
>
> Ben
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ed Popielarski
> Sent: Wednesday, April 08, 2015 2:16 PM
> To: [log in to unmask]
> Subject: EXTERNAL: Re: [TN] Transfer Soldering
>
> http://store.curiousinventor.com/guides/Surface_Mount_Soldering/QFP/
>
>
> Ed Popielarski
> Engineering Manager
>
>
>                                970 NE 21st Ct.
>                               Oak Harbor, Wa. 98277
>
>                               Ph: 360-675-1322
>                               Fx: 206-624-0695
>                               Cl: 949-581-6601
>
>
>
>        "It's one kind of victory to slay a beast, move a mountain, and
> cross a chasm, but it's another kind altogether to realize that the
> beast, the mountain, and the chasm were of your own design."
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>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
> Sent: Wednesday, April 08, 2015 10:44 AM
> To: [log in to unmask]
> Subject: Re: [TN] Transfer Soldering
>
> Possibly a problem with terms here.
> We usually think of transfer soldering as transfer printing of solder
> paste via pins, or other shaped tools from a controlled depth pool of
> solder to the work and then reflowing.
> I think what is meant in the question is melting a gob of solder onto
> 'iron bit (tip in US English) and then transferring to the work.
> This is usually not thought good technique as there is a tendency for the
> flux core to be burnt out on the tip before reaching the work.
> So extra flux could be applied to work, also improving thermal transfer,
> as remarked.
>
> It's possible for a good operator to obtain acceptable results in
> prototyping/low volume doing this. Higher volumes would merit a little
> more thought on designing a less craft like process.
>
> --
> Best Wishes
>
>
>
> Mike
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman
> Sent: Wednesday, April 08, 2015 2:45 PM
> To: [log in to unmask]
> Subject: Re: [TN] Transfer Soldering
>
> Ben - do you mean dippable solder paste?
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
> On Wed, Apr 8, 2015 at 8:40 AM, Gumpert, Ben <[log in to unmask]> wrote:
>
>> Technetters,
>>
>> Anyone have comments on transfer soldering?
>> It's identified in an IPC video as one of the seven sins of soldering,
>> but seems to be focused on non-visible joints like through hole, as
>> opposed to SMT or wire soldering.
>>
>> There was a paper mentioned on Technet a while back which claimed
>> transfer soldering was just as good as 'normal' soldering, but there
>> was just a
> link
>> to the abstract.
>>
>> Ben
>>
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