Hi Pete - with an adequate reflow profile and the selection of an adequate
flux, not a big deal. Most of today's low residue flux formulations or the
"old" RMA type flux formulations will remove 40nm of oxide without any
issues.

Dave

On Wed, Apr 8, 2015 at 1:17 PM, Peter G. Houwen <[log in to unmask]>
wrote:

> Dave,
>
> So what is the impact of that 40nm on solderability?
>
> Pete
>


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