Possibly a problem with terms here.
We usually think of transfer soldering as transfer printing of solder paste
via pins, or other shaped tools from a controlled depth pool of solder to
the work and then reflowing.
I think what is meant in the question is melting a gob of solder onto 'iron
bit (tip in US English) and then transferring to the work.
This is usually not thought good technique as there is a tendency for the
flux core to be burnt out on the tip before reaching the work.
So extra flux could be applied to work, also improving thermal transfer, as
remarked.

It's possible for a good operator to obtain acceptable results in
prototyping/low volume doing this. Higher volumes would merit a little more
thought on designing a less craft like process.
 
--
Best Wishes
 
 
 
Mike

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman
Sent: Wednesday, April 08, 2015 2:45 PM
To: [log in to unmask]
Subject: Re: [TN] Transfer Soldering

Ben - do you mean dippable solder paste?

Dave Hillman
Rockwell Collins
[log in to unmask]

On Wed, Apr 8, 2015 at 8:40 AM, Gumpert, Ben <[log in to unmask]> wrote:

> Technetters,
>
> Anyone have comments on transfer soldering?
> It's identified in an IPC video as one of the seven sins of soldering, but
> seems to be focused on non-visible joints like through hole, as opposed to
> SMT or wire soldering.
>
> There was a paper mentioned on Technet a while back which claimed transfer
> soldering was just as good as 'normal' soldering, but there was just a
link
> to the abstract.
>
> Ben
>
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