TECHNET Archives

April 2015

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Gumpert, Ben" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gumpert, Ben
Date:
Wed, 8 Apr 2015 13:46:40 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
No, I mean applying solder to the iron, and then transferring it to the joint.

Ben

From: David Hillman [mailto:[log in to unmask]]
Sent: Wednesday, April 08, 2015 9:45 AM
To: TechNet E-Mail Forum; Gumpert, Ben
Subject: EXTERNAL: Re: [TN] Transfer Soldering

Ben - do you mean dippable solder paste?

Dave Hillman
Rockwell Collins
[log in to unmask]<mailto:[log in to unmask]>

On Wed, Apr 8, 2015 at 8:40 AM, Gumpert, Ben <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Technetters,

Anyone have comments on transfer soldering?
It's identified in an IPC video as one of the seven sins of soldering, but seems to be focused on non-visible joints like through hole, as opposed to SMT or wire soldering.

There was a paper mentioned on Technet a while back which claimed transfer soldering was just as good as 'normal' soldering, but there was just a link to the abstract.

Ben

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]>
______________________________________________________________________


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2