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April 2015

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Wed, 1 Apr 2015 07:46:04 -0600
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HA! HA! HA! Sounds like the typical stuff that comes out of the EU.
Sheesh...


On Wed, Apr 1, 2015 at 7:38 AM, Brian Ellis <[log in to unmask]> wrote:

> The Institute of Waste Reduction in Electronics in Germany have made a
> proposal to the EU that the next review of RoHS incorates a clause to ban
> all through-hole components. This is because the amount of solder and flux
> used is twice as much, compared with surface-mount components. They also
> propose re-introducing lead into solder pastes as they consider the easier
> wetting of 63/37 produces smaller fillets.
>
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