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April 2015

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Subject:
From:
"Weller, Tim" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Weller, Tim
Date:
Wed, 1 Apr 2015 08:42:39 -0500
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April fools??

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Wednesday, April 01, 2015 8:38 AM
To: [log in to unmask]
Subject: [TN] Reduce wastage

The Institute of Waste Reduction in Electronics in Germany have made a proposal to the EU that the next review of RoHS incorates a clause to ban all through-hole components. This is because the amount of solder and flux used is twice as much, compared with surface-mount components. 
They also propose re-introducing lead into solder pastes as they consider the easier wetting of 63/37 produces smaller fillets.

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