Hi Dwight,
OK - these have to be button/selective plated - ever seen that? And we
have to etch .004 spaces after the button plate. Regards Steve

On 2015-04-24, 3:30 PM, "Dwight Mattix" <[log in to unmask]> wrote:

>if you're at the right fab, that can be solid
>copper filled (plated full).  We see a lot of
>that used, esp in "core" vias in 2n2 and 3n3 uVia stackups.
>
>A lot of extreme aspect ratio Loadboard and
>Probecard designs use 5 and 6 mil flipdrilled
>thru vias as thick as 5mm overall. Those finish
>after plating in 3-4 mil range at the knee.
>Those (very) select few shops that can fill those
>plated vias up beyond 30:1 aspect ratio with the
>likes of San-Ei and then overplate for socket or probe contacts.
>
>At 07:13 AM 4/23/2015, Steven Kelly wrote:
>>Hi All,
>>Do you think it is feasible to do non-conductive
>>via fill on a .0025- .003 finished hole size ­
>>overall thickness is .028. Regards Steve
>>
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