if you're at the right fab, that can be solid 
copper filled (plated full).  We see a lot of 
that used, esp in "core" vias in 2n2 and 3n3 uVia stackups.

A lot of extreme aspect ratio Loadboard and 
Probecard designs use 5 and 6 mil flipdrilled 
thru vias as thick as 5mm overall. Those finish 
after plating in 3-4 mil range at the knee.
Those (very) select few shops that can fill those 
plated vias up beyond 30:1 aspect ratio with the 
likes of San-Ei and then overplate for socket or probe contacts.

At 07:13 AM 4/23/2015, Steven Kelly wrote:
>Hi All,
>Do you think it is feasible to do non-conductive 
>via fill on a .0025- .003 finished hole size ­ 
>overall thickness is .028. Regards Steve
>
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