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April 2015

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Subject:
Re: Via Fill
From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Thu, 23 Apr 2015 17:48:23 +0000
Content-Type:
text/plain
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text/plain (22 lines) 
Sure--just use underfill for the via filler.

In the absence of doing that yourself, I would think that standard via fill
practices would come up short.

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Thursday, April 23, 2015 10:13 AM
To: [log in to unmask]
Subject: [TN] Via Fill

Hi All,
Do you think it is feasible to do non-conductive via fill on a .0025- .003
finished hole size - overall thickness is .028. Regards Steve

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