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April 2015

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Subject:
Re: Via Fill
From:
"Robert e. welch" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 23 Apr 2015 17:47:45 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
If you mean 0.025" then by all means.
If you mean 0.0025" then don't know.

Robert E. Welch
Senior Process Engineer
Moog Components Group

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Thursday, April 23, 2015 10:13 AM
To: [log in to unmask]
Subject: [TN] Via Fill

Hi All,
Do you think it is feasible to do non-conductive via fill on a .0025- .003 finished hole size - overall thickness is .028. Regards Steve

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