Hi Wayne - yes, we have a family of power devices where we put a indium
preform in a "thermal well" and then place the device on top of it. The
indium deforms nicely and makes excellent contact with both the well and
device surfaces for very good thermal conductivity. Kind of a pricey
configuration but necessary for the functionality of the device. Also be
careful of exposure to the product use environment as indium has some fun
corrosion characteristics.

Dave Hillman
Rockwell Collins
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On Tue, Apr 21, 2015 at 3:35 PM, Wayne Thayer <[log in to unmask]> wrote:

> Has anybody watching this forum mounted devices using indium foil preforms
> for getting electrical/thermal contact to an RF power device which can't
> take the full heat of reflow? I know this is an opportunity for AlNi
> nanofoils and eutectic SnPb solder, but I'm looking at a job now where the
> previous assembly house apparently was successful with indium foil.
>
>
>
> Thanks!
>
>
>
> Wayne Thayer
>
> KEYW Corporation
>
> 7763 Old Telegraph Rd.
>
> Severn, MD  21144
>
> 443.274.1554 desk
>
> 443.534.8036 mobile
>
> 443.274.1501 fax
>
> [log in to unmask]
>
>
>


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