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April 2015

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Subject:
From:
"Honsowetz, Eric" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Honsowetz, Eric
Date:
Thu, 16 Apr 2015 17:11:24 -0400
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Good Afternoon Victor et al,

I'm unsure if you are talking about copper bond wires between the die and the lead frame or something else...

Assuming you are talking the die to lead frame, then there are a number of studies showing that that a number of changes are required to maintain reliability due to differences in the inter-metallic area and the susceptibility of that area to various chemicals, such as Cl.

The change from gold bond wire to copper bond wire is definitely not simple & if a supplier is proposing it be sure to make sure they have done their homework or you may have reliability issues.       


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Tuesday, April 14, 2015 9:01 AM
To: [log in to unmask]
Subject: [TN] Copper Wire Bonds

Fellow TechNetters:

   What is the story behind Copper Wire Bonds.   I have heard of them but now I have witness one.   Any details out there on this technology?   I will have to search archives.

Victor,


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