Has anybody watching this forum mounted devices using indium foil preforms
for getting electrical/thermal contact to an RF power device which can't
take the full heat of reflow? I know this is an opportunity for AlNi
nanofoils and eutectic SnPb solder, but I'm looking at a job now where the
previous assembly house apparently was successful with indium foil.
Thanks!
Wayne Thayer
KEYW Corporation
7763 Old Telegraph Rd.
Severn, MD 21144
443.274.1554 desk
443.534.8036 mobile
443.274.1501 fax
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