The Institute of Waste Reduction in Electronics in Germany have made a 
proposal to the EU that the next review of RoHS incorates a clause to 
ban all through-hole components. This is because the amount of solder 
and flux used is twice as much, compared with surface-mount components. 
They also propose re-introducing lead into solder pastes as they 
consider the easier wetting of 63/37 produces smaller fillets.

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