Hello,

Not a good practice, but I am merging here two different pending questions I have...
I am currently looking for the following :

1.       Is there any IPC document addressing the via/hole plating integrity?

I seem to remind an IPC TM-650 document with a criterion on the via resistance after a defined thermal cycling test (less than +/- xx% of the initial resistance). I came across it before IST, so it was not this one...



2.       An Excel spreadsheet enabling the calculation of the gold percentage within a solder joint.

Something was shared over TechNet some years ago, but I did not manage to find it.



Thanks in advance for your help.

Best regards,

Arnaud Grivon

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