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Subject:
From:
"Watson, Howard August" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Watson, Howard August
Date:
Fri, 13 Mar 2015 22:01:59 +0000
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Joyce,
John answered the question about seal material. Not sure about your other questions, but I do see matching chips on the two lids which could indicate a severe collision. I don't like the lid alignment problem either, which appears to be a contributor. Thanks for your help!

Howard A. Watson 


-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Friday, March 13, 2015 10:29 AM
To: TechNet E-Mail Forum; Watson, Howard August
Subject: Re: [TN] Mechanical failure of 8-pin Cerdip

what is the seal material?  the substrate surface finishing? (especially the lid surface finishing).  If you use polymeric material as a seal, your fine leak test doesn't mean anything - He got absorbed in the polymer...
is it glass or metal seal?  what kind?  please don't drop a satellite on my head on Fri the 13.
                   jk
> Drew,
>
> Thanks for the feedback, and it is good to hear that someone has seen 
> this defect before with a cerdip. I was wondering if this type of 
> problem might be more prevalent with the cerdips.
>
> Howard A. Watson
>
>
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Friday, March 13, 2015 8:57 AM
> To: [log in to unmask]; Watson, Howard August
> Cc: [log in to unmask]
> Subject: RE: Mechanical failure of 8-pin Cerdip
>
> Howard,
>
> Not common but it does happen.  I have witnessed this once.  When I 
> was working at Fisher Controls International.  This was in the pre ICT days.
> Each assembly type had a custom made test box designed and built for it.
> One of the test department folks called us out to see this.  He had  a 
> completed assembly on the test box.  The assembly was fully 
> functional, passed all set up and test process.  When he had finished 
> test he noticed a fourteen pin Cerdip missing it's lid.  Electrically 
> sound.  We joked about shipping it that way but of course off to 
> repair it went.  Cerdips can fail at the glue line if impacted hard or 
> if the bond was compromised in some fashion when it was made.  As long 
> as it is very rare all you can do is scrap the bad part or tube of 
> parts if your uncomfortable with the risk on the balance of parts in the tube.
>
> Drew Meyer
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Watson, Howard 
> August
> Sent: Friday, March 13, 2015 9:36 AM
> To: [log in to unmask]
> Subject: [TN] Mechanical failure of 8-pin Cerdip
>
> Hello TechNet,
>
> I have an IC Op Amp that was found in stock with the lid separated. 
> The stock room discovered this while kitting components, so this part 
> was minimally handled. It was stored in the original IC tube. 
> Collectively, we have never seen an occurrence of something like this, 
> and I wonder if any of you have experienced this before. The 
> explanation I got from the manufacturer is that it is most likely a 
> packing and/or handling problem and that if there is too much slack in 
> the tubes, the parts colliding together could cause the lid to pop 
> off. Wouldn't the seal material be more robust than to allow the lid 
> to pop off? My concern is that we have
> 120 of these all from one lot, and if there was a processing problem, 
> then maybe I have some other poorly bonded lids that may separate. Do 
> you think my concern is valid, or is this a one-off rare handling caused defect?
> These are space grade parts.
>
> Thanks to Steve, a couple pictures are posted on the links below. I 
> don't know what could be determined from the first picture, other than 
> yes, the lid definitely popped off! The second picture shows another 
> IC with a lid slightly skewed, but within tolerance I believe. Thanks 
> in advance for any suggestions you can offer.
>
> http://stevezeva.homestead.com/RH1078MJ8-1.jpg
> http://stevezeva.homestead.com/RH1078MJ8-2.jpg
>
> Howard A. Watson
>
>
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