TECHNET Archives

March 2015

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Fri, 13 Mar 2015 15:12:23 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (110 lines)
Hi Howard,

Unbelievable that someone would have a process that produced that second
photograph you provided and call it the highest level of reliability. Just
for the lid mis-alignment, I can't imagine a production line that was within
its production control criteria ending up with a lid that far off of center.
And that's not even considering all of the scratches and debris and the
mildly bent leads. I'd be real interested to hear whether they pass
hermeticity, and even if they do, I'd dump them. Maybe LT will allow their
name to be put on a product shipped like that, but I won't allow mine unless
there is truly no alternative.

I forgot to mention that in the olden days, the reputable packaging houses
would put some small dots of RTV on the ends of CERDIPs destined for tubes
so there'd be no chipping. RTV or no RTV though, I never saw a lid come off
without some pretty severe encouragement (glass seals).

Wayne


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Watson, Howard August
Sent: Friday, March 13, 2015 11:03 AM
To: [log in to unmask]
Subject: Re: [TN] Mechanical failure of 8-pin Cerdip

Hi Wayne,

No joke with these parts, it is the real thing. I have all the paper work,
and I did purchase the space data package with this lot. It includes all the
test data- fine/gross leak, bond pull, RGA, etc. Though some parts were
rejected from various screening tests, the lot passed everything. Thanks for
your take on this.

Howard A. Watson 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Friday, March 13, 2015 8:50 AM
To: [log in to unmask]
Subject: Re: [TN] Mechanical failure of 8-pin Cerdip

Hi Howard-

Thanks for the amusing photographs!

This is a joke, right? I mean, that picture of the second part looks like it
was sitting on the road, and had gotten run over about a dozen times. I
don't understand why the leads seem "kind of" straight, but they are enough
out of line that I still consider the "road theory" viable.

The first picture reveals that the parts were put together with something
crappy. I would like to see shattered glass when the seal breaks! These look
like some kind of mal-cured epoxy. Probably there is a hermeticity spec
these are supposed to meet and, if you need an excuse to reject them, try
doing fine and gross leak tests.

I'm thinking counterfeit, or rather, product that was rejected by the
original packaging house which found its way somehow into the brokers
market. I know, the manufacturer deflected a decision, but I suspect you are
unable to trace the lineage of these parts back to an authorized
distributor, right?

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Watson, Howard August
Sent: Friday, March 13, 2015 10:36 AM
To: [log in to unmask]
Subject: [TN] Mechanical failure of 8-pin Cerdip

Hello TechNet,

I have an IC Op Amp that was found in stock with the lid separated. The
stock room discovered this while kitting components, so this part was
minimally handled. It was stored in the original IC tube. Collectively, we
have never seen an occurrence of something like this, and I wonder if any of
you have experienced this before. The explanation I got from the
manufacturer is that it is most likely a packing and/or handling problem and
that if there is too much slack in the tubes, the parts colliding together
could cause the lid to pop off. Wouldn't the seal material be more robust
than to allow the lid to pop off? My concern is that we have 120 of these
all from one lot, and if there was a processing problem, then maybe I have
some other poorly bonded lids that may separate. Do you think my concern is
valid, or is this a one-off rare handling caused defect? These are space
grade parts.

Thanks to Steve, a couple pictures are posted on the links below. I don't
know what could be determined from the first picture, other than yes, the
lid definitely popped off! The second picture shows another IC with a lid
slightly skewed, but within tolerance I believe. Thanks in advance for any
suggestions you can offer.

http://stevezeva.homestead.com/RH1078MJ8-1.jpg
http://stevezeva.homestead.com/RH1078MJ8-2.jpg

Howard A. Watson


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________

ATOM RSS1 RSS2