(1) shelf life I-Sn is not as good as electroplated - you better  
store in good place if you intend to use as low volume high mix,  
including repair --- definitely not for the "life time buy" type of  
design.
(2) depend upon the flux-paste you use and reflow condition, you may  
or may not see the difference
(3) depend upon where you get your board - usually, electroplated you  
can get good one from many vendors (if you do not have stringer  
requirements on flatness, they can plate enough to cover the Cu....),  
but few really do good on immersion.  if your flux is a less active  
type, the wetting might be a bit of problem if you get a "me too" guy...
(4) if your tolerance for SMT is good on your design - not on the  
bleeding edge type, immersion from "me too" guy might be OK.  if you  
need mil-2000 class III wetting on the heel/toe, etc.etc. stay with  
electroplate if I were you ;-).  the spc chart of std deviation might  
be a bit broad (FWHM) especially when the immersion type at end of  
shelf life...
my 1.6 cents.
                 jk
On Mar 5, 2015, at 8:51 PM, Guy Ramsey wrote:

> Can anyone give me a nutshell difference between immersion tin for  
> a solder
> finish and electroplated tin?
> Advantages, disadvantages as a surface finish more than the  
> chemical and
> plating process differences.
> Thanks,
> Guy
>
>
>
>
>
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