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March 2015

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Subject:
Package Definition
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Hillman <[log in to unmask]>
Date:
Tue, 31 Mar 2015 16:49:46 -0500
Content-Type:
text/plain
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text/plain (15 lines) 
Hi folks - does anyone know if JEDEC (or some other industry association)
have a industry recognized definition of  Ball Grid Array,  Chip Scale
Package and  Flip Chip style packages? I am looking for some standard or
specification that defines these packages as package styles/types.

Dave Hillman
Rockwell Collins
[log in to unmask]


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