Hi Victor - not much data in the public domain on that topic. About the
best you can do is get a copy of the International Tin Research Institute's
Publication 656 titled "Solder Alloy Data". Publication 565 contains
tensile, fatigue and shear data for a number of solder alloys over various
temperature and stress/strain rates. The testing we completed back in the
early 1990's at Rockwell Collins on plated thru hole strength nearly always
resulted in failure of the plated thru hole/laminate rather than the solder
joint itself using slow tensile speeds (unpublished). Plate thru hole
solder joints are truly indestructable.

Dave Hillman
Rockwell Collins
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On Fri, Mar 27, 2015 at 3:10 PM, Victor Hernandez <
[log in to unmask]> wrote:

> Fellow TechNetters;
>
>    Does anyone have information on the following:
>                Finish hole size, lead diameter, solder type, thickness of
> board and lead length.   How much force does it require to pull out a lead
> from the solder joint.   Will the lead come out cleanly or elongated and
> snap,
>
> Victor,
>
>
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