Victor,
I did - when I was at Nortel in the 1990s.  But I don't have that info now,
but I CAN say I NEVER saw a lead fail when it was pulled out of eutectic
tin/lead solder from a 62 thou thick board.  And here at Blackberry, I have
never seen a USB through hole lead fail when pulled out of SAC solder in
boards around a mm thick.  The solder always gives way first.  I cannot tell
you what the numbers are, but I can say that any executive, sales person,
etc. who thinks solder is a really good meahanically robust material is,
well, a tad WRONG!!

Regards,
Bev

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Friday, March 27, 2015 4:11 PM
To: [log in to unmask]
Subject: [TN] Leaded component, lead pull test

Fellow TechNetters;

   Does anyone have information on the following:
               Finish hole size, lead diameter, solder type, thickness of
board and lead length.   How much force does it require to pull out a lead
from the solder joint.   Will the lead come out cleanly or elongated and
snap,

Victor,


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