Hi Bob,

The J-STD states that gold shall be removed from 95% of the soldered
surfaces if it is more than 2.54 micrometers thick. I think if you look at
the datasheet for a lot of parts (not all parts mind you), you'll find that
the gold does not exceed that thickness. So maybe you're tinning parts that
you don't really need to tin...

Steve

On Fri, Mar 27, 2015 at 7:29 AM, Bob Wettermann <[log in to unmask]> wrote:

> We have a contract where we have to place parts per JSTD-001 process
> guidance (Class 2 and Class 3).
>
> There are some THOLE parts that are gold-plated (RF connectors) wit gold
> pins and some leadless SMT devices with gold pads.
>
> Based on the client's interpretation of the spec all of these parts need to
> be tinned.
>
> For such a small lot size (5 boards per P/N) are people hand tinning a few
> components or send them out to be retinned? What is your experience with
> the co-planarity of the leadless devices post tinning using a manual
> process?
>
> Regards
>
>
> --
> Bob Wettermann
> BEST Inc
>
>
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