Phil, notes similar to 1 and 2 below I see commonly on bare board drawings. It is incorrect to have such notes.
601X documents are "Qualification and Performance Specification(s)..." for printed circuit boards. One cannot fabricate a board in accordance with, for example, 6012. One can fabricate a board which conforms to 6012.
On page 2 of A-600H, the 3rd paragraph from the bottom of the 2nd column states
"IPC-6010 series establishes the minimum acceptability requirements for printed boards. This document, IPC-A-600, is a companion and complementary document, providing pictorial interpretation of these requirements. It is not intended to be used as a performance specification for printed board manufacture or procurement."
Technet has dealt with these points a couple of times in past years. Looks like your vendor could have a better understanding of the meaning and purpose of these documents. Louis Hart
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nutting, Phil
Sent: Wednesday, March 25, 2015 2:52 PM
To: [log in to unmask]
Subject: [TN] bare board acceptability, IPC-600 versus IPC 6012
A vendor has found a conflict in one of our control documents.
The question from our vendor;
In Section 4 (Construction Requirements), points 1 and 2 appear to be somewhat in conflict. We had ordered the boards under IPC-A-600 Class 2 before we received your document. However, your specification says that while the boards will be accepted under IPC-A-600 Class 2, they need to be manufactured under IPC-6012 Class 2. The IPC-6012 is a much tighter standard requiring test coupons, microsectioning and such. They (and therefore we) are asking for confirmation that the 6012 manufacturing requirement is needed since the acceptance criteria is the less stringent standard.
The text from our document;
4. Construction Requirements
1.... Acceptance of finished Printed Boards shall be in accordance with IPC-A-600, Class 2.
2.... Fabricate PCB in accordance with IPC-6012, Class 2 and use customer supplied data files when specified.
We have never micro-sectioned our boards nor used test coupons because they are very low volume, sometimes as few as five boards per order. Also we still use a lot of thru-hole boards and the few surface mount boards are typically only 2 or 4 layer.
Our mix of boards go from control boards with 15 volt logic to multiplier boards that can see up to 180 kV. This specific order is for 180 kV multiplier boards 0.06 inch thick, two layer with component silk screens, no solder mask and tin/lead HASL.
In scanning through the two IPC documents I'm having trouble figuring out how to match them up for comparison.
They just need clarification and I need to fix my document. Your wisdom is greatly appreciated.
Phil Nutting | HVP Development Engineer | Excelitas Technologies Corp
Lab: +1 978.224.4332 | Office: +1 978.224.4152
35 Congress St, Salem, MA 01970 USA
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www.excelitas.com<http://www.excelitas.com/>
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