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March 2015

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Subject:
BTC with Power Pad
From:
Jack Olson <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Mon, 2 Mar 2015 10:49:08 -0600
Content-Type:
text/plain
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text/plain (21 lines) 
I may have misunderstood, but I thought I heard someone at the APEX
conference imply that it was not a good practice to tie GROUND PINs of
"Bottom Terminated Components" directly to the grounded THERMAL PAD
underneath the device.
Did I hear that right?
I should have asked when I had the chance, but I got distracted.


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